ADVANCED TECHNIQUES REFLOW SYSTEMS

Key Features:

• Full Forced Air Convection
• Lead-Free Compatible
• Up to 10 individually programmable heating zones
• Small footprint saves lab space
• Stationary Loading Tray with 20" x 20" (508mm x 508mm) reflow area
• Precise software control with unlimited profile storage capacity
• Software monitoring and profiling capability
• No Warm-Up time required before operating
• External Thermocouple Control
• Automatic Profile Repeat function (up to 10 times)
• Library of predefined profiles
• Password protected login for engineers and operators
• Plug and Operate Configuration
• Exhaust port for fume extraction
• Minimal maintenance
• Designed and Manufactured in US
• 5 years warranty

Product Overview

PRO 1600-B is a benchtop full forced air convection reflow oven. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO 1600-B is very flexible in terms of profile development and optimization. Sealed heating chamber enables air ramp up rates of up to 4° Celsius/second and programming of up to 10 profile zones. Its unique on-the-fly settings adjustment capability allows creating and optimizing profiles all in a single pass. Where other batch and conveyer ovens fail to meet the desired profile curve, PRO 1600-B excels.

Precise software control delivers unsurpassed temperature uniformity. Maintaining a low delta T across all of the components on the assembly ensures that they are not overheated or thermally stressed. Even for prototypes, this often means avoiding to spend days testing and debugging failed boards. With the optional External Thermocouple Control (ETC), profiles may be processed based on temperature readings of the assembly, not the air temperature around it. Increased productivity, superior performance and ease of operation make the PRO 1600-B a versatile system ideal for small to medium run production, prototyping, testing or curing.

Typical Reflow Soldering Applications

• Printed Circuit Board (PCB) assemblies requiring high quality and repeatable results in prototype - medium volumes (depending on PCB size).
• Single or Double Sided PCB’s with standard or Pb-Free solders.
• Densely populated, high thermal mass assemblies.
• Surface Mount Devices per IPC / JEDEC J-STD-020 and JESD22-A113F standards for Leaded and Pb-Free profiles
• IPC-TM-650 Test Method 2.6.27 - Thermal Stress, Convection Reflow Assembly Simulation / IPC-9631.
• Bare PCB’s to simulate profiles developed for volume production environments.
• Delamination and other quality issues testing on multilayer PCB’s.
• Various composite materials for analysis / testing.
• Copper heatsinks to PCB’s using preforms.
• Gold / Tin reflow.
• Pre-conditioning reflows of IC’s while in extruded aluminum tubes.
• Aluminum pins to a metal housing.
• Flex connector to ceramic substrate.
• Surface Mount Devices / Passive Components to ceramic substrate.
• Connector filters with fluxed preforms.
• LED’s in production quantities.
• Various solder pastes for analysis in an R&D environment.

Specifications

For further information please contact ATERON LTD.