SONY SMT Mounter, Pick and Place, Chip Shooter Systems

Further productivity and efficiency

The SI-G200 high-speed mounter, boasting a placement tact time of 0.08 seconds, is a two- head model inheriting the advantages of the cellular mounter, including high mounting precision, space-saving design, and low power consumption. The high-performance mounter responds to various operational needs by allowing a flexible combination of its replaceable
"high-speed head" and "multifunction head" so as to best match the production line.

Top-class productivity per footprint

The two-head model uses one head for placement and the other head for pickup. It achieves a dramatically shorter pickup and placement rotation time by making the two mount heads operate simultaneously between the cassette and the PWB. The SI-G200 boasts top-class productivity, placing up to 45,000 components per hour (CPH)-a 70% improvement over the 25,900 CPH of Sony's SI-F130.

Economic mounting as previous model : Lowest power consumption compared to competition

While the CPH value is an important productivity factor, the running cost is equally important. Sony emphasizes energy efficiency in all of its products to minimize the running cost and environmental friendly. The SI-G200 is also extremely power-efficient.

SI-G200 High-speed head

• Placement tact time:0.08sec/2 heads/movable(45,000CPH)
• Placement precision:45μm(Cpk 1.0 or greater)
• Component size ranges:0402 up to a 12mm square(movable camera), 6mm to 25mm square(fixed camera)
• Component height:6mm

SI-G200 Multifunction head

• Placement tact time:0.16sec/2 heads(22,500CPH)
• Placement precision:50μm(Cpk 1.0 or greater)(individual recognition), 60μm(Cpk 1.0 or greater)(collective recognition)
• Component size ranges:1005 chip to 100mm x 50mm

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Planet head realizes 25,900 CPH

Equipped with a Planet Head or a patented rotary head incorporating a new overlap function, The SI-F130AI achieves even higher mounting speed. As the head rotates freely in two directions, the sequences for part pickup and mounting can be set automatically and optimally, minimizing effective tact time. Additionally, the use of fully closed servo control ensures the highest level of precision.

Equipped with rotary head so called "Planet head"

New mechanism that drastically extends the maintenance intervals. High rigidity is also achieved by this new mechanism. In addition, newly optimized sequence guarantees a high level of accuracy.

Photo reflective/transmission part recognition

The Planet Head offers not only reflective part recognition, but transmission part recognition as well. These two recognition modes enable a cellular mounter to handle a wider range of parts, assuring you the capability to accommodate more diverse part sizes and high-density mounting.

• Placement tact time:25,000CPH
• Placement precision:50μm(Cpk 1.0 or greater)
• Component size ranges:0402(chip) up to a 12mm square(movable camera), 6mm to 25mm square(fixed camera/option)
• Component height:6mm
• Dimension:1,220(W)mm x 1,400(D)mm x 1,434(H)mm

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High precision for fine-pitch Components

Compact-sized fine-pitch component mounter for high precision mounting. The non-stop operation achieved with flying vision and flying nozzle change functions reduce the actual tact time loss during parts pickup and mounting. It contributes to the productivity improvement.

High-Precision Mounting

Both the fixed-position and moving cameras contribute to achieving high-precision mounting. This enables the cellular mounter to easily respond to smaller PWBs and higher-density mounting requirements, such as handling BGA/CSP mounting with a finer grid pitch.

Supporting Wider Range of Parts

The cellular mounter can be used to process products ranging from microchip parts to large connectors. Despite its compact size, its feeder units are designed to accommodate up to 40 cassettes (front) and 80 trays (rear), making it possible for a single machine to mount high-density PWBs.

Pursuing Space-Saving Design and Operability

The cellular mounter is only 1.2 m wide, while supporting a PWB size as large as 460 mm × 360 mm. It offers the highest level of space efficiency.

• Placement tact time: 7,350CPH(0.49sec/movable camera)2,500CPH(1.4sec/fixed camera)
• Placement precision: ±0.06mm (chip)
• Component size: 2012-□32mm(movable camera/reflective imaging)/2012-□19mm(movable camera/transmissive imaging) 2012-□18mm (fixed camera/reflective imaging) □18-□43mm(fixed camera/reflective imaging,medium view range,batch) -φ150mm(fixed camera reflective, medium, large view range, division into 4)
• Thickness: Max.25mm
• External dimensions: 1,220(W)mm x 1,700(D)mm x 1,524(H)mm

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