The OptiCon SPI-Line 3D enables precise three-dimensional solder paste printing measurement in terms of height, volume, offset and smearing.
The core element is a specifically developed 3D camera head functionally based on the fringe projection principle, operating without moving parts. There are three different system configurations determined by lateral resolutions of 10 μm, 15 μm and 20 μm.
In high-speed mode the system achieves an inspection speed of up to 90 cm²/s with extraordinary precision.
For further information or quotation request please contact ATERON LTD.