corner viewing for alignment of larger packages at high magnification. High quality components within the optics system ensure a clear and distortion free imaging. Precise closed loop reflow process control enables mimicking the original production profile. Software contains a database of predefined profiles which the user selects based on the package and PCB being reworked. An Automated Profile Generation feature allows the user to develop an optimum profile in a single pass that may be saved for future processing. Profiles may be easily modified, optimized, and stored for future use. Settings can be adjusted on-the-fly while the profile is running. Software controls reflow via forced air / nitrogen convection top heater, forced air convection localized bottom heater, and a large area Quartz IR preheater. Airflow at the top heater is monitored by the software as well and delivers unsurpassed temperature uniformity. This guarantees very gentle flow which cannot disturb even the smallest adjacent components. Controlled cooling of the part and PCB is accomplished via direct air / nitrogen flow at the top nozzle, air flow at the localized bottom heater, and large area underside board cooling.
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